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| apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com specification ssc - stw0q2pa rohs
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com features applications description ? lead frame type led pkg size: 5.6*3.0 thickness 0.9mm ? white colored smt package ? pb - free reflow soldering application ? rohs compliant ? interior lighting ? general lighting ? indoor and out door displays ? architectural / decorative lighting stw0q2pa stw0q2pa this surface - mount led comes in standard package dimension. it has a substrate made up of a molded plastic reflector sitting on top of a lead frame. the die is attached within the reflector cavity and the cavity is encapsulated by silicone. the package design coupled with careful selection of component materials allow these products to perform with high reliability. apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com [ contents ] 1. outline dimensions of stw0q2pa 2. characteristics of stw0q2pa 3. characteristic diagrams 4. color & binning 5. bin code description 6. labeling 7. packing 8. recommended solder pad 9. soldering 10. precaution for use 11. handling of silicone resin leds apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 1. outline dimensions of stw0q2pa notes : [1] all dimensions are in millimeters. [2] scale : none [3] undefined tolerance is 0.1mm [4] forward current is 50ma per die for parallel inner circuit. package total forward current is 100ma top view side view bottom view a c1 n.c c2 package marking slug apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com material structure si thermo plastic silicone metal blue led metal description - zener diode +phosphor encapsulation gold wire wire gan on sapphire chip source heat - resistant polymer body copper alloy (silver plated) lead frame materials name parts no. apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 2. characteristics of stw0q2pa 1) electro - optical characteristics at 100ma 2) absolute maximum ratings o c 125 t j junction temperature parameter symbol value unit forward current i f 160 ma power dissipation* [1] p d 592 mw peak forward current i fm [2] 300 ma operating temperature t opr - 40 ~ +85 o c storage temperature t stg - 40 ~ +100 o c esd (hbm) 5,000v hbm v parameter symbol value unit min typ max forward voltage [1] v f 2.9 3.2 3.4 v reverse voltage v r - 0.9 1.2 v luminous intensity* [2] i v - 10.5 - cd luminous flux - 31.8 - lm correlated color temperature cct 4,200 - 7,000 k viewing angle [3] 2 1/2 - 120 - deg. color rendering index* ra 68 - thermal resistance [4] r th js - 15 - o c/w *notes : led s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. [1] care is to be taken that power dissipation does not exceed t he absolute maximum rating of the product. [2] ifm was measured at tw 1 msec of pulse width and d 1/10 of duty ratio. (ta=25 , rh30%) *notes : all measurements were made under the standardized environment o f ssc. [1] forward current is 50ma per die for parallel inner circuit. package total forward current is 100ma [2] the luminous intensity iv was measured at the peak of the sp atial pattern which may not be aligned with the mechanical axis of the led package. [3] 2 1/2 is the off - axis where the luminous intensity is 1/2 of the peak intensity. [4] thermal resistance: rthjs (junction / solder) * tolerance : vf : 0.1v, iv : 7%, ra : 2, x,y : 0.01 apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 1) spectrum data (if=100ma, ta=25 , rh30%) 3. characteristic diagrams 300 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 relative emission intensity wavelength [nm] apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 3) forward current vs. relative luminous intensity, ta=25 2) forward voltage vs. forward current, ta=25 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 1 10 100 forward current i f [ma] forward voltage v f [v] 0 20 40 60 80 100 120 140 160 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 relative luminous intensity forward current i f [ma] apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 4) chromaticity coordinate vs. forward current, ta=25 0.285 0.286 0.287 0.288 0.289 0.290 0.291 0.294 0.296 0.298 0.300 0.302 0.304 20ma 60ma 100ma 150ma 200ma y x apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 5) relative light output vs. junction temperature, if=100ma 40 60 80 100 120 0.0 0.2 0.4 0.6 0.8 1.0 relative light output junction temperation t j (? ) apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 6) chromaticity coordinate vs. junction temperature 0.270 0.275 0.280 0.285 0.290 0.295 0.280 0.285 0.290 0.295 0.300 0.305 0.310 25 44 64 84 104 y x apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 8) ambient temperature vs. maximum forward current 7) forward voltage shift vs. junction temperature -40 -20 0 20 40 6 0 8 0 1 00 0 2 0 4 0 6 0 8 0 10 0 12 0 14 0 16 0 18 0 20 0 forward current i f [ma] a m b ie n t te m p e ra tu re t a ( o c ) r th j -a = 1 00 o c /w 40 60 80 100 120 0.0 0.2 0.4 0.6 0.8 1.0 relative forward voltage junction temperation t j (? ) apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 9) viewing angle, ta=25 -90 -60 -30 90 60 30 0 apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 4. color & binning 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37 0.38 0.39 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37 0.38 0.39 0.40 0.41 42 00k 45 00k 47 00k 50 00k 7000k c4 b4 c2 b2 c0 b0 a5 a4 a3 a2 a1 53 00k 5600k 6000k 6500k cie y cie x a0 b1 b3 b5 c1 c3 c5 d0 d2 d4 d1 d3 d5 apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com color rank apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com color rank apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 5. bin code description 4,200k ~ 7,000k 4,200k ~ 7,000k color rank @ i f = 100ma a ~ d forward voltage [v] @ i f = 100ma rank min. max. y3 2.9 3.0 z1 3.0 3.1 z2 3.1 3.2 z3 3.2 3.3 a1 3.3 3.4 30.0 10000 9500 s5 37.5 13000 12000 w0 luminous intensity [ mcd ] * [1] @ i f = 100ma flux * [2] [lm] rank min. max. typ. s0 9000 9500 28.9 t0 10000 10500 31.0 t5 10500 11000 32.5 v0 11000 11500 33.1 v5 11500 12000 34.7 available ranks not yet available ranks *notes : all measurements were made under the standardized environment of ssc. [1] the leds are sorted based on luminous intensity measurements. [2] the typical lumen values are included for reference only. z1 b2 t5 forward voltage [v] color rank luminous intensity [ mcd ] bin code s5 s5 w0 w0 iv rank v5 v5 t5 t5 s0 s0 t0 t0 v0 4200~5300 k (cie c,d) v0 5300~7000 k (cie a,b) cct apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 6. labeling # 1 # 2 # 3 - #1 : luminous intensity : iv [ cd ] - #2 : color coordinates : x, y - #3 : forward voltage : v f [v] rank x 1 x 2 - x 3 x 4 - x 5 - x 6 x 7 - x 8 x 9 full code form : - x 1 : company - x 2 : kind of led - x 3 x 4 : cri group - x 5 : package series - x 6 x 7 : characteristic code - x 8 : version - x 9 : old version apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 7. packing 1 side outer box structure material : paper(sw3b(b)) ? ? ? humidity indicator aluminum vinyl bag reel desi pak part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. type size (mm) ? ? ? 7inch 245 220 102 245 220 142 apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 180 2 13 22 60 15.4 1.0 13 0.3 ( tolerance: 0.2, unit: mm ) 1) quantity : 3500pcs/reel 2) cumulative tolerance : cumulative tolerance/10 pitches to be 0.2mm 3) adhesion strength of cover tape : adhesion strength to be 0.1 - 0.7n when the cover tape is turned off from the carrier tape at the angle of 10 ? to the carrier tape. 4) package : p/n, manufacturing data code no. and quantity to be in dicated on a damp proof package. 7. packing apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 8. recommended solder pad notes : [1] all dimensions are in millimeters. [2] scale : none [3] undefined tolerance is 0.1mm this drawing without tolerances are for reference only. apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 22 22 9. soldering * caution 1. reflow soldering is recommended not to be done more t han two times. in the case of more than 24 hours passed soldering after first, leds will be damaged. 2. repairs should not be done after the leds have been soldered. when repair is unavoidable, suitable tools must be used. 3. die slug is to be soldered. 4. when soldering, do not put stress on the leds during heating. 5. after soldering, do not warp the circuit board. ipc/jedec j - std - 020 profile feature sn - pb eutectic assembly pb - free assembly average ramp - up rate ( tsmax to tp ) 3 c/second max. 3 c/second max. preheat - temperature min ( tsmin ) - temperature max ( tsmax ) - time ( tsmin to tsmax ) ( ts ) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 180 seconds time maintained above: - temperature (tl) - time ( tl ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak temperature ( tp ) 215 260 time within 5 c of actual peak temperature (tp)2 10 - 30 seconds 20 - 40 seconds ramp - down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com 10. precaution for use (1) storage to avoid the moisture penetration, we recommend store in a dry box with a desiccant . the recommended storage temperature range is 5c to 30c and a maximum humidity of rh50%. (2) use precaution after opening the packaging use proper smd techniques when the led is to be soldered dipped as separation of the lens may affect the light output efficiency. pay attention to the following: a. recommend conditions after opening the package - sealing - temperature : 5 ~ 40 humidity : less than rh30% b. if the package has been opened more than 4 week(msl_2a) or the c olor of the desiccant changes, components should be dried for 10 - 12hr at 60 5 (3) do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) do not rapidly cool device after soldering. (5) components sh ould not be mounted on warped (non coplanar) portion of pcb. (6) radioactive exposure is not considered for the products list ed here in. (7) gallium arsenide is used in some of the products listed in t his publication. these products are dangerous if they are burned or shredded in the process of d isposal. it is also dangerous to drink the liquid or inhale the gas generated by such products w hen chemically disposed of. (8) this device should not be used in any type of fluid such as water, oil, organic solvent and etc. when washing is required, ipa (isopropyl alcohol) should be used. (9) when the leds are in operation the maximum current should be decided after me asuring the package temperature. (10) leds must be stored properly to maintain the device. if the leds are stored for 3 months or more after being shipped from ssc, a sealed container with a nitrogen atmosphere should be used for storage. (11) the appearance and specifications of the product may be mod ified for improvement without notice. (12) long time exposure of sunlight or occasional uv exposure will ca use lens discoloration. (13) vocs (volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of leds and discolor when exposed to heat and photonic energy. the result can be a significant loss of light o utput from the fixture. knowledge of the properties of the materials selected to be use d in the construction of fixtures can help prevent these issues. (14)attaching leds , do not use adhesives that outgas organic vapor. (15)the driving circuit must be designed to allow forward voltag e only when it is on or off. if the reverse voltage is applied to led, migration can be gener ated resulting in led damage. apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z - power led x10490 z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - stw0q2pa stw0q2pa september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com (1) during processing, mechanical stress on the surface should b e minimized as much as possible. sharp objects of all types should not be used to pierce the seal ing compound. (2) in general, leds should only be handled from the side. by the way, this also app lies to leds without a silicone sealant, since the surface can also become sc ratched. (3) when populating boards in smt production, there are basicall y no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on th e surface of the resin must be prevented. this is assured by choosing a pick and place nozzle which is la rger than the led s reflector area. (4) silicone differs from materials conventionally used for the manufacturing of leds . these conditions must be considered during the handling of such devices. compared to standard encapsulants , silicone is generally softer, and the surface is more likely to attract dust. as mentioned previously, the increased sensitivity to dust requ ires special care during processing. in cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components . (5) ssc suggests using isopropyl alcohol for cleaning. in case o ther solvents are used, it must be assured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led. (6) please do not mold this product into another resin (epoxy, u rethane, etc) and do not handle this. product with acid or sulfur material in sealed space. 11. handling of silicone resin leds |
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